中山LNP THERMOCOMP EC004APQ

应用范围：　　产品描述　　LNP THERMOCOMP EC004APQ物性表　　聚醚酰亚胺，20%碳纤维增强材料，LNP THERMOCOMP EC004APQ is a compound based on Polyetherimide containing 20% Carbon Fiber. Added feature of this grade includes: Electrically Condu

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　　产品描述

　　中山LNP THERMOCOMP EC004APQ物性表

　　聚醚酰亚胺，20%碳纤维增强材料，中山LNP THERMOCOMP EC004APQ is a compound based on Polyetherimide containing 20% Carbon Fiber. Added feature of this grade includes: Electrically Conductive.