中山LNP THERMOCOMP Lexan_EXCP0008
应用范围： 产品描述 LNP THERMOCOMP Lexan_EXCP0008物性表 LNP* Thermocomp* Lexan_EXCP0008 compound is a 20% glass beads filled PC injection moulding resin
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中山LNP THERMOCOMP Lexan_EXCP0008物性表
LNP* Thermocomp* Lexan_EXCP0008 compound is a 20% glass beads filled PC injection moulding resin
来源：http://zs.va-so.com/product827910.html
发布时间：2022/5/9 11:39:44
