中山LNP THERMOCOMP Lexan_EXCP0011
应用范围： 产品描述 LNP THERMOCOMP Lexan_EXCP0011SF008物性表 LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
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产品描述
中山LNP THERMOCOMP Lexan_EXCP0011SF008物性表
LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
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发布时间：2022/5/9 11:39:49
