中山LNP THERMOCOMP Lexan_SML5750
应用范围：产品描述LNP THERMOCOMP Lexan_SML5750物性表50% glass bead and filament reinforced. 270F HDT. Will be commercialized as LGB5030N.
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产品描述
中山LNP THERMOCOMP Lexan_SML5750物性表
50% glass bead and filament reinforced. 270F HDT. Will be commercialized as LGB5030N.
来源：http://zs.va-so.com/product827947.html
发布时间：2022/5/9 12:02:39
