中山LNP THERMOCOMP Lexan_SML5790
应用范围： 产品描述 LNP THERMOCOMP Lexan_SML5790物性表 Nonhalogenated, 10% glass filled PC. Internal mold release. Thin-wall applications.
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产品描述
中山LNP THERMOCOMP Lexan_SML5790物性表
Nonhalogenated, 10% glass filled PC. Internal mold release. Thin-wall applications.
来源：http://zs.va-so.com/product827948.html
发布时间：2022/5/9 12:03:30
