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中山LNP THERMOCOMP Lexan_SML5897

中山LNP THERMOCOMP Lexan_SML5897

应用范围:  产品描述  LNP THERMOCOMP Lexan_SML5897物性表  LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.

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  产品描述

  中山LNP THERMOCOMP Lexan_SML5897物性表

  LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.


来源:http://zs.va-so.com/product827950.html
发布时间:2022/5/9 12:04:39

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